A new study published in the journal Advanced Functional Materials has revealed that a graphene-based film can cool down electronic devices. Researchers used the thermal conductivity capacity to create a film and the capacity was four times that of copper.
Researchers from the Chalmers University of Technology found that this film is attachable to electronic components of silicon. There is an increasing demand to increase the functionality of smartphones and tablets, which tend to overheat. Reduction in the heat can prolong the lifespan of the device and may lead to a considerable reduction in energy usage.
“We have now solved this problem by managing to create strong covalent bonds between the graphene film and surface,” said John Liu, a professor at the university.
A few years back, researchers discovered that graphene had a cooling effect on silicon-based electronics, thus creating an interest for research on electronics that incorporate graphene. Liu stated that the methods they have been working all the while have only generated questions for researchers. After the addition of more layers of graphene there was considerable reduction in the heat, but resulted in the issue of adhesiveness. However, the adhesion is held together by Van Der Waals bonds.
Researchers created strong covalent bonds, with the addition of (3-Aminopropyl) triethoxysilane (APTES) molucles that created the most desired effect. During heating, Silane bonds were created between the electronic component and graphene through hydrolysis. The study found that silane coupling doubled the thermal conductivity of graphene. Now, the in-plane conductivity of a graphene-based film with 20 micrometer thickness can reach a thermal conductivity of 1600W/mK, four times that of copper.
Liu said that the increased thermal capacity could lead to several new applications for graphene. He added that graphene could pave way for faster, smaller, more energy efficient, sustainable high power electronics.
[ Source ]