Amazon Fire Phone is making a strong buzz in the market for many reasons than not. The experts were too curious about the making of the device and hence iFixit tore down the phone to find out the secrets in it. The 24-step teardown report has been framed by the iFixit team about Amazon’s first smartphone, the Fire Phone.
This device is equipped with 1280 x 720 pixel display and a screen size of 4.7 inches. The rear camera of the smartphone is measured at 13MP and the front facing camera is built with a 2.1MP sensor. It has an internal storage capacity of 32 GB. Another variant of device’s internal storage is measured at 64 GB. It runs on Android-based Fire OS 3.5 software and is priced at $199, with a contract.
The important thing to notice is that Amazon Fire phone is actually not easy to take apart and fix it back. It is a typical feature in the current day smartphones, but iFixit has given Amazon Fire phone a rating of 3/10 when it comes to reparability. It possesses an ample number of wires and other constraints which make it harder for the user to take it apart and pull it back together.
The team of iFixit went through a challenging time while working with the device’s infrared cameras and projectors. The 3D hardware embossed in the device impressed the team iFixit a lot. Amazon Fire Phone makes use of 4 IR cameras that are located at different corners of the phone, ensuring the feature of adjusting person’s face in respect to the screen while clicking the pictures.
Let us talk about the specs of the device. It packs a quad-core 2.2GHz Snapdragon 800 application processor and a graphic processor. It also boasts a dynamic perspective sensor and a projection system along with a gyroscope, accelerometer, barometer, magnetometer and proximity sensor.
Here are the findings of iFixit found on the device’s logic board:
- Samsung K3QF2F200A-QGCE 16 GB (2GB) LPDDR3 RAM (the CPU and GPU are layered underneath this chip, per iFixit)
- Samsung KLMBG4GEAC-B001 32 GB eMMC NAND Flash
- Qualcomm WCD9320 audio codec
- Qualcomm QFE2320 multiband power amplifier
- InvenSense MPU6500 (labeled as MP65 G266B1 L1351) NXP 47803 NFC controller
And the chips found on the back of the Fire Phone’s logic board:
- Qualcomm PM8941 power management IC
- Qualcomm WTR1625L RF transceiver
- DPR EAE99
- Skyworks SKY85702-11 5 GHz WLAN front-end module
- Qualcomm WCN3680 802.11ac combo Wi-Fi/Bluetooth/FM chip
The iFixit team has gone into minute details when it comes to exploring the new smartphone launched by Amazon. We hope the teardown of the device will be of great help to the experts and fans.
Amazon Fire Phone iFixit teardown Image Gallery:
Here goes the teardown video posted by iFixit:
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